IT News 
Kingston Captures 62% Revenue Share to Extend Global DRAM Module Leadership for 23rd Year
(0)Underscoring its long-term dominance across the global memory supply chain, Kingston Technology has been ranked the world’s top third-party DRAM module supplier for the 23rd consecutive year, according to market intelligence firm TrendForce. Kingston commanded an estimated 62% share of global market revenue in 2025, capturing nearly two-thirds of the entire sector. In a year… Read More ›
Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture
Cadence (Nasdaq: CDNS) today announced that its Tensilica IP Group and Analog Devices, Inc. (ADI) worked together to develop the latest generation of SHARC® automotive audio processors, further strengthening ADI’s industry-leading position in premium in-vehicle audio solutions. The joint effort brings Cadence’s highly optimized Tensilica DSP architecture into the next-generation ADSP product family from ADI,… Read More ›
A10 Networks Launches A10 AI Gateway, an Intelligent Control Plane for Unified Management of All AI Operations
A10 Networks (NYSE: ATEN) today announced that A10 AI Gateway, an intelligent control plane for centrally managing AI use across organizations, is scheduled to become available in the fourth quarter of 2026. A10 AI Gateway provides unified routing, cost management and governance across the AI agents, applications and large language models (LLMs) used by organizations…. Read More ›
Cadence PCIe 6.0 Subsystem on TSMC N3 Achieves First-Pass Compliance to Accelerate AI and HPC Silicon
Cadence Design Systems (Nasdaq: CDNS) has announced that its complete PCI Express® (PCIe®) 6.0 PHY and controller subsystem, implemented on TSMC’s leading-edge N3 process, achieved first-pass compliance success at PCI-SIG’s inaugural PCIe 6.0 compliance workshop. Validated at the full standard throughput of 64 GT/s in an x8 configuration, the tape-out-ready IP block has been officially… Read More ›
Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing
Samsung Electronics and ASML announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next generation of innovation in the AI era. Building on years of successful cooperation, the companies will work together to accelerate the development and deployment of… Read More ›
Cadence Introduces AuraStack AI Super Agent for PCB and Advanced Packaging
Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning to final product in a single AI-native environment. The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA… Read More ›
Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design
Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads). The joint effort combines Rapidus’ AI-native design and manufacturing ecosystem for advanced-node semiconductors with Cadence’s agentic AI design orchestration technology to… Read More ›
Canon Malaysia Expands EOS Filmmaker Line Up with Two Acclaimed Directors
Canon Marketing Malaysia (“Canon”) announced the addition of acclaimed Malaysian filmmakers Quek Shio Chuan and Razaisyam Rashid to its EOS Filmmaker Programme 2026, further strengthening Canon’s commitment to supporting the local filmmaking community and nurturing creative storytelling talent. The appointment expands Canon’s EOS Filmmaker line-up from three to five members, reflecting the company’s continued strategic… Read More ›
Transcend Launches New 218-Layer 3D NAND Storage Solutions to Power AI Computing and Edge Applications
Transcend Information, Inc. announced its new generation of industrial SSD and memory card solutions powered by advanced 218-layer 3D NAND flash technology. Featuring optimized architecture and increased storage density, the new product lineup unlocks the full potential of next-generation flash memory performance to address the growing demands of AIoT edge computing and smart manufacturing. Designed… Read More ›
Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
Cadence (Nasdaq: CDNS) today announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A. The new multi-year agreement combines Cadence’s agentic AI-driven EDA and Design IP solutions with Intel’s process innovation and advanced design expertise. The DTCO collaboration focuses on optimizing tools, flows,… Read More ›
