Lenovo Introduces Its First Googlebook, Delivering Premium AI Experiences in a Sleek, Lightweight Design
Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture
Gainward GeForce RTX 5060 Ti Ghost Series Delivers No-Nonsense Blackwell Performance for 1080p Gamers
Kingston Backs Visual Storytellers Across Southeast Asia for World Tourism Day
PALIT Combines Factory Overclocking with Unique Anime Styling in New RTX 5060 Ti RiTONA OC
A10 Networks Launches A10 AI Gateway, an Intelligent Control Plane for Unified Management of All AI Operations
Cadence PCIe 6.0 Subsystem on TSMC N3 Achieves First-Pass Compliance to Accelerate AI and HPC Silicon
ASUS Announces WiFi 8 Router Availability in Malaysia
Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing
Kingston Introduces Dependable Storage and RAM for Faster Learning Workflows
Acer PA100 Portable SSD Delivers Fast File Transfers Across Modern Devices
MSI Packs AMD Ryzen AI Max+ 395 and 128GB Unified Memory into 4-Liter PRO MAX EDGE AI+
Product News »
Lenovo Introduces Its First Googlebook, Delivering Premium AI Experiences in a Sleek, Lightweight Design
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Lenovo today introduced the Lenovo Googlebook 15, its first Googlebook, expanding the company’s laptop portfolio by combining Google’s computing experiences with Lenovo’s signature design, engineering, and user-focused innovation. Powered by Intel Core Ultra 5 processors with built-in Gemini Intelligence, up to 32GB of memory² and up to 512GB of storage², the Lenovo Googlebook 15 helps… Read More ›
IT News »
Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture
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Cadence (Nasdaq: CDNS) today announced that its Tensilica IP Group and Analog Devices, Inc. (ADI) worked together to develop the latest generation of SHARC® automotive audio processors, further strengthening ADI’s industry-leading position in premium in-vehicle audio solutions. The joint effort brings Cadence’s highly optimized Tensilica DSP architecture into the next-generation ADSP product family from ADI,… Read More ›
- A10 Networks Launches A10 AI Gateway, an Intelligent Control Plane for Unified Management of All AI Operations
- Cadence PCIe 6.0 Subsystem on TSMC N3 Achieves First-Pass Compliance to Accelerate AI and HPC Silicon
- Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing
Review »
Unboxing the Kingston 2024 Mini Dragon USB Drive: Unleash the Beast in Data Storage
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Kingston has released the highly anticipated 2024 Mini Dragon USB Drive. Nestled in an adorable dragon egg case, the new Mini Dragon USB Flash Drive boasts a generous 128GB capacity, making it the perfect holiday gift for people on-the-go. We’re delighted to have received the Kingston 2024 Mini Dragon USB Drive, and today, we’ll be… Read More ›
Event »
Intel Unveils Three Complementary Architectures at Hot Chips 2026 to Power Agentic AI from Data Center to Edge
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At Hot Chips 2026, Intel outlined an ambitious architectural roadmap designed to power enterprise-scale agentic AI workloads across the entire computing continuum. The company showcased a triad of purpose-built silicon architectures: the next-generation Diamond Rapids Xeon processor for high-performance orchestration, the Crescent Island GPU for high-density, energy-efficient inference, and the Wildcat Lake SoC for intelligent… Read More ›
